Boron Nitride film on copper foil
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Single and Multi layer h-BN film on Copper foil


Single layer and Multi layer h-BN (Boron Nitride) film grown on copper foil.

Lead Time: 1 - 3 business days

h-BN is an insulator with a direct band gap of 5.97 eV. Due to its strong covalent sp2 bonds in the plane, the in-plane mechanical strength and thermal conductivity of h-BN has been reported to be close to that of graphene. h-BN has an even higher chemical stability than graphene; it can be stable in air up to 1000 °C (in contrast, for graphene the corresponding temperature is 600 °C).

During Chemical Vapor Deposition, BN is grown on both sides of the copper foil. 

Specifications: Single layer

  • Close to complete coverage (90-95%), with some minor holes
  • Thickness of the copper foil is 20 microns
  • High crystalline quality, see SAD (Selected area [electron] diffraction) data
  • Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

  • Specifications: Multi layer

  • Close to complete coverage (90-95%), with some minor holes
  • Average Thickness of BN film is 13 nm
  • Thickness of the copper foil is 20 microns
  • Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

  • If transferred onto an SiO2 substrate, the BN film may be seen as a white film. However, it is difficult to recognize the BN film on copper using a microscope.

    If transferred onto an SiO2 substrate, the BN film may be seen as a white film. However, it is difficult to recognize the BN film on copper using a microscope.

    Transfer: PMMA Procedure, similar to that of graphene. It may be transferred on most substrates, which we may do in-house as custom work.


    PRICE LIST

    (Shipping charges included)

    Single layer h-BN (Boron Nitride) film on copper foil:

    2" x 1"

    SEK 3160

    Multi-layer h-BN (Boron Nitride) film on copper foil: 

    2" x 1"

    SEK 3160

    Boron Nitride film on copper foil